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Keywords [ ic manufacturing machines ] match 59 Products.

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

MOQ: 1

Mold Cooling System	Water Cooling
Tolerance	±0.01mm
Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks

VIDEO

High efficient Semiconductor Molding Equipment Chip Molding System 50/60Hz

MOQ: 1 set

Capacity	100 Tons
Clamping Force	1000 KN
Control System	PLC
Frequency	50/60Hz
Injection Speed	200 Mm/s

VIDEO

High Productivity Semiconductor Molding Equipment Auto Chip Molding System

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	10000 KN
Control System	PLC
Injection Pressure	200 MPa

VIDEO

Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient

MOQ: 1 set

Application	Semiconductor Industry
Capacity	100 Tons
Clamping Force	1000 KN
Control System	PLC
Cooling System	Water Cooling

VIDEO

Full Auto Semiconductor Production Equipment For Injection Molding

MOQ: 1 set

Accuracy	High
Application	Semiconductor Manufacturing
Automation Level	Fully Automated
Capacity	High
Clamping Force	High

Trimming Forming Dies For Semiconductor

MOQ: 1 set

Features	High Wear Resistance
Application	Automotive Industry
Compatibility	Compatible With Various Press Machines
Design	Customizable
Durability	Long Service Life

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface, Easy To Use
Advantages	Efficient, Cost-effective, Time-saving
Application	Metal Trimming And Forming
Compatibility	Compatible With Various Press Machines
Customization	Available

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface
Application	Metal Trimming And Forming
Compatibility	Fits With Various Machines
Durability	Long-lasting
Hardness	HRC 58-62

VIDEO

Water Cooling Semiconductor Processing Equipment Semicon Molding System High Pressure

MOQ: 1 set

Application	Semiconductor Industry
Automation	Fully Automatic
Capacity	High
Control System	PLC
Cooling System	Water Cooling

Polished Trim And Form Dies Semiconductor Package Dies Customizable

MOQ: 1 set

Application	Metal Forming
Compatibility	Compatible With Various Machines
Cost	Affordable
Customization	Available
Durability	High

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ic manufacturing machines

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

High efficient Semiconductor Molding Equipment Chip Molding System 50/60Hz

High Productivity Semiconductor Molding Equipment Auto Chip Molding System

Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient

Full Auto Semiconductor Production Equipment For Injection Molding

Trimming Forming Dies For Semiconductor

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

Water Cooling Semiconductor Processing Equipment Semicon Molding System High Pressure

Polished Trim And Form Dies Semiconductor Package Dies Customizable