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Phone Number :	+86 13450030904
WhatsApp :	+8613450030904

Keywords [ molding molds ] match 157 products.

Auto Mold System Semiconductor Chip Making Machine High Efficiency

MOQ: 1 set

Application	Semiconductor Manufacturing
Capacity	1000 Tons
Clamping Force	1000 KN
Injection Pressure	200 MPa
Injection Speed	100 Mm/s

High Durability Semiconductor Molding Machine Automated ISO9001 Approval

MOQ: 1 set

Application	Semiconductor Manufacturing
Capacity	500-1000 Tons
Clamping Force	Hydraulic
Control System	PLC
Cooling System	Water/Oil

High Performance Semiconductor Molding Machine 220V Longer Lifespan

MOQ: 1 set

Control System	PLC
Cooling System	Water
Frequency	50Hz
Heating Zones	6
Injection Pressure	200 MPa

DIP Series Plastic Seal MGP Mold Wear Resistance High Performance

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

ProE Design Software Chip Packaging MGP Mold With ISO9001 2015 Control Certification

MOQ: 1

Mold Life	500,000 Shots Or More
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Ejection System	Ejector Pin, Ejector Sleeve, Ejector Blade, Etc.
Mold Weight	50kg-10 Tons
Quality Control	ISO9001:2015, SGS, ROHS

Hot Runner MGP Mold For High Precision Parts Ejector Pin Long Span Life

MOQ: 1

Mold Base	LKM, DME, HASCO Or Customized
Mold Life	500,000 Shots Or More
Mold Standard	DME, HASCO, LKM Or Customized
Surface Treatment	Mirror Polishing
Cavity	Single Or Multi

SGS Certified MGP Mold

MOQ: 1

Quality Control	ISO9001:2015, SGS, ROHS
Mold Standard	DME, HASCO, LKM Or Customized
Cooling System	Water Cooling Or Air Cooling
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Runner System	Hot Runner Or Cold Runner

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High Productivity Semiconductor Packaging Equipment Chip Molding Device

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

Fully Automatic Semiconductor Molding Equipment

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

Customizable Manufacturing Semiconductor Mold Progressive Die

MOQ: 1 set

Application	IC Lead Frame Stamping
Cavity	Single/Multi
Ejection Type	Automatic
Hardness	HRC 50-60
Material	Steel

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

tjin@taijinbdt.com

+86 13450030904

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molding molds

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Auto Mold System Semiconductor Chip Making Machine High Efficiency

High Durability Semiconductor Molding Machine Automated ISO9001 Approval

High Performance Semiconductor Molding Machine 220V Longer Lifespan

DIP Series Plastic Seal MGP Mold Wear Resistance High Performance

ProE Design Software Chip Packaging MGP Mold With ISO9001 2015 Control Certification

Hot Runner MGP Mold For High Precision Parts Ejector Pin Long Span Life

SGS Certified MGP Mold

High Productivity Semiconductor Packaging Equipment Chip Molding Device

Fully Automatic Semiconductor Molding Equipment

Customizable Manufacturing Semiconductor Mold Progressive Die