Application | Semiconductor Industry |
---|---|
Capacity | 100 Tons |
Clamping Force | 1000 KN |
Cooling System | Water Cooling |
Heating Power | 10 KW |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 1000 Tons |
Control System | PLC |
Injection Pressure | 200 MPa |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | 1000 Tons |
Clamping Force | 1000 KN |
Control System | PLC |
Application | Mold Making |
---|---|
Color | Silver |
Compatibility | Universal |
Corrosion Resistance | Yes |
Durability | High |
Application | Stamping Of IC Lead Frames |
---|---|
Compatibility | Suitable For Various IC Lead Frame Sizes |
Customization | Available |
Delivery | By Sea Or Air |
Dimension | Customized |
Accuracy | High |
---|---|
Application | IC Lead Frame Production |
Cavity | Single |
Cooling System | Water Cooling |
Dimension | Customized |
Capacity | 1000 Tons |
---|---|
Clamping Force | 1000 Tons |
Ejector Force | 200 Tons |
Injection Pressure | 2000 Bar |
Injection Unit | Single |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 5000 KN |
Control System | PLC |
Cooling Zones | 4 |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | High |
Clamping Force | High |
Control System | PLC |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 1000 Tons |
Control System | PLC |
Injection Pressure | 2000 Bar |