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Keywords [ molding molds ] match 157 products.

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PLC Control Semiconductor Molding Equipment Automatic Encapsulation System

MOQ: 1 set

Control System	PLC
Application	Semiconductor Industry
Product Type	Molding Equipment
Cycle Time	Short
Automation	Fully Automated

Single Injection Unit Semiconductor Molding Machine With 35Mm Screw

MOQ: 1

Max. Mold Height	400 Mm
Cooling System	Water
Injecti On Unit	Single
Weight	5 Tons
Heating Power	12 KW

Low Energy Consumption Semiconductor Molding Equipment For Automatic Molding Press

MOQ: 1 set

Control System	PLC
Energy Consumption	Low
Maintenance	Easy
Molding Method	Injection Molding
Precision	High

Water Cooling Steel IC Lead Frame Stamping Mold Hardness HRC50-60

MOQ: 1

Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks
Mold Cooling System	Water Cooling
Tolerance	±0.01mm

Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength

MOQ: 1

Tolerance	±0.01mm
Mold Base	LKM, DME, HASCO, Etc.
Mold Life	100,000 Shots
Mold Type	Stamping Mold
Lead Time	4-6 Weeks

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection

MOQ: 1

Mold Life	500,000 Shots Or More
Runner System	Hot Runner Or Cold Runner
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Mold Base	LKM, DME, HASCO Or Customized
Mold Standard	DME, HASCO, LKM Or Customized

Integrated Circuit IC Lead Frame Stamping Mold Wear Resistance

MOQ: 1 set

Application	Integrated Circuit (IC) Lead Frame Stamping
Material	Steel
Mold Hardness	HRC 50-60
Mold Life	500,000-1,000,000 Shots
Mold Material	SKD11, SKH-9, DC53, Or Customized

100 KW Semiconductor Molding Machine Automatic Encapsulation System

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	5000 KN
Control System	PLC
Injection Pressure	200 MPa

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC Control
Ejector Force	50 KN
Ejector Stroke	300 Mm

Auto Transfer Semiconductor Molding Machine

MOQ: 1 set

Application	Semiconductor Industry
Automation Grade	Automatic
Capacity	Depends On Model
Clamping Force	Depends On Model
Control System	PLC

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molding molds

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

PLC Control Semiconductor Molding Equipment Automatic Encapsulation System

Single Injection Unit Semiconductor Molding Machine With 35Mm Screw

Low Energy Consumption Semiconductor Molding Equipment For Automatic Molding Press

Water Cooling Steel IC Lead Frame Stamping Mold Hardness HRC50-60

Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection

Integrated Circuit IC Lead Frame Stamping Mold Wear Resistance

100 KW Semiconductor Molding Machine Automatic Encapsulation System

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

Auto Transfer Semiconductor Molding Machine