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Contact Person :	Zhao
Phone Number :	+86 13450030904
WhatsApp :	+8613450030904

Keywords [ semiconductor production equipment ] match 148 products.

Fully Automatic Semiconductor Molding Equipment

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

Automatic Semiconductor Packaging Equipment With Water Cooling System

MOQ: 1

Platen Size	600 X 600 Mm
Clamping Force	1000 KN
Max. Mold Height	400 Mm
Cooling System	Water
Model	SM-1000

Thermoplastics Semicon Molding Device Semiconductor Processing Equipment 200MPa

MOQ: 1 set

Application	Semiconductor Industry
Automation	Fully Automatic
Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC

1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 Tons
Ejector Force	200 Tons
Injection Pressure	2000 Bar
Injection Unit	Single

Automatic Layup IC Chip Making Machine Semiconductor Processing Equipment ISO9001

MOQ: 1 set

Capacity	1000 Chips Per Minute
Communication	Ethernet
Dimensions	1200mm X 800mm X 1500mm
Interface	Touch Screen
Material	Stainless Steel

Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

MOQ: 1 set

Application	Injection Molding
Cavity	Single Or Multi
Cooling System	Water Or Oil
Delivery	By Sea Or Air
Design Software	UG, Pro/E, AutoCAD

VIDEO

Auto Plastic Cutting And Molding Semiconductor Manufacturing Equipment

MOQ: 1 set

Air Consumption	100L/min
Air Pressure	0.5-0.7MPa
Control System	PLC
Dimensions	1200mm X 800mm X 1600mm
Forming Material	PVC, PET, PP, PS, Etc.

VIDEO

Industrail 2.5kW Trim And Form Machine Semiconductor Fab Equipment

MOQ: 1 set

Air Consumption	50L/min
Air Pressure	5-7kg/cm²
Control System	PLC Control System
Dimensions	1200mm X 800mm X 1500mm
Forming Accuracy	±0.1mm

VIDEO

Single Injection Semiconductor Molding Machine Fully Automatic Transfer Molding

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC
Injection Speed	200 Mm/s

PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making Machine

MOQ: 1 set

Control System	PLC
Ejector Force	200 KN
Heating Power	50 KW
Injection Pressure	200 MPa
Injection Rate	1000 Cm3/s

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

tjin@taijinbdt.com

+86 13450030904

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semiconductor production equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Fully Automatic Semiconductor Molding Equipment

Automatic Semiconductor Packaging Equipment With Water Cooling System

Thermoplastics Semicon Molding Device Semiconductor Processing Equipment 200MPa

1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision

Automatic Layup IC Chip Making Machine Semiconductor Processing Equipment ISO9001

Semiconductor Production MGP Mould Tool SOP Series Corrosion Resistance

Auto Plastic Cutting And Molding Semiconductor Manufacturing Equipment

Industrail 2.5kW Trim And Form Machine Semiconductor Fab Equipment

Single Injection Semiconductor Molding Machine Fully Automatic Transfer Molding

PLC Control Auto Semiconductor Encapsulation Equipment Semiconductor Making Machine