| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC Control |
| Injection Speed | 1000 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automated |
| Capacity | High |
| Control System | PLC |
| Frequency | 50Hz/60Hz |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | High |
| Control System | PLC |
| Cooling System | Water Cooling |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | 1000 Tons |
| Control System | PLC |
| Cooling System | Water Cooling |
| Control System | PLC |
|---|---|
| Application | Semiconductor Industry |
| Product Type | Molding Equipment |
| Cycle Time | Short |
| Automation | Fully Automated |
| Control System | PLC |
|---|---|
| Energy Consumption | Low |
| Maintenance | Easy |
| Molding Method | Injection Molding |
| Precision | High |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | 1000 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 10000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |