Cycle Time | Short |
---|---|
Safety Features | Advanced |
Material | Plastic |
Automation | Fully Automated |
Molding Method | Injection Molding |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 5000 KN |
Control System | PLC |
Injection Pressure | 200 MPa |
Application | Semiconductor Industry |
---|---|
Automation Grade | Automatic |
Capacity | Depends On Model |
Clamping Force | Depends On Model |
Control System | PLC |
Application | Semiconductor Industry |
---|---|
Capacity | 100 Tons |
Clamping Force | 1000 KN |
Control System | PLC |
Heating Zones | 4 |
Application | Semiconductor Industry |
---|---|
Capacity | 100 Tons |
Clamping Force | 1000 KN |
Cooling System | Water Cooling |
Heating Power | 10 KW |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 1000 Tons |
Control System | PLC |
Injection Pressure | 200 MPa |
Screw Diameter | 35 Mm |
---|---|
Type | Vertical Injection Molding Machine |
Injection Unit | Single |
Capacity | 100 Tons |
Cooling System | Water |
Max. Mold Height | 400 Mm |
---|---|
Cooling System | Water |
Injecti On Unit | Single |
Weight | 5 Tons |
Heating Power | 12 KW |
Application | Semiconductor Manufacturing |
---|---|
Capacity | 1000 Tons |
Clamping Force | 1000 KN |
Injection Pressure | 200 MPa |
Injection Speed | 100 Mm/s |
Application | Semiconductor Manufacturing |
---|---|
Capacity | 500-1000 Tons |
Clamping Force | Hydraulic |
Control System | PLC |
Cooling System | Water/Oil |