| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | High |
| Clamping Force | High |
| Control System | PLC |
| Control System | PLC |
|---|---|
| Ejector Force | 200 KN |
| Heating Power | 50 KW |
| Injection Pressure | 200 MPa |
| Injection Rate | 1000 Cm3/s |
| Capacity | 1000 Units/hour |
|---|---|
| Clamping Force | 200 Tons |
| Control System | PLC |
| Cooling System | Water |
| Injection Pressure | 100 MPa |
| Application | Sorting And Organizing Electronic Chips |
|---|---|
| Dimensions | 1200mm*800mm*1600mm |
| Power Consumption | 500W |
| Power Supply | AC 220V/50Hz |
| Sorting Accuracy | 99.99% |
| Dimensions | Approx. 1,200mm X 1,200mm X 1,500mm |
|---|---|
| Power Supply | AC 220V, 50/60Hz |
| Forming Size | Max. 110mm X 110mm |
| Trimming Size | Max. 110mm X 110mm |
| Control System | PLC Control System |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Control System | PLC |
|---|---|
| Cooling System | Water |
| Frequency | 50Hz |
| Heating Zones | 6 |
| Injection Pressure | 200 MPa |
| Cycle Time | Short |
|---|---|
| Safety Features | Advanced |
| Material | Plastic |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Heating Zones | 4 |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC |
| Injection Pressure | 200 MPa |