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Phone Number :	+86 13450030904
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Keywords [ semiconductor packaging equipment ] match 148 products.

Auto Molding System In Semiconductor Fabrication Equipment 1000 Tons Capacity

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	1000 Tons
Control System	PLC
Injection Pressure	2000 Bar

Fully Automatic Semiconductor Molding Equipment

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

VIDEO

90KW Semiconductor Molding Equipment Semicon Transfer Molding Device

MOQ: 1 set

Capacity	2000 Tons
Clamping Force	2000 KN
Control System	PLC
Injection Pressure	200 MPa
Injection Speed	300 Mm/s

1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 Tons
Ejector Force	200 Tons
Injection Pressure	2000 Bar
Injection Unit	Single

Automatic Layup IC Chip Making Machine Semiconductor Processing Equipment ISO9001

MOQ: 1 set

Capacity	1000 Chips Per Minute
Communication	Ethernet
Dimensions	1200mm X 800mm X 1500mm
Interface	Touch Screen
Material	Stainless Steel

VIDEO

Auto Plastic Cutting And Molding Semiconductor Manufacturing Equipment

MOQ: 1 set

Air Consumption	100L/min
Air Pressure	0.5-0.7MPa
Control System	PLC
Dimensions	1200mm X 800mm X 1600mm
Forming Material	PVC, PET, PP, PS, Etc.

VIDEO

Plastic Cutting Molding Semiconductor Production Equipment 220V/50Hz

MOQ: 1 set

Air Consumption	0.2m³/min
Air Pressure	0.5-0.8MPa
Control System	PLC
Dimensions	1200mm800mm1600mm
Forming Accuracy	±0.2mm

VIDEO

Industrail 2.5kW Trim And Form Machine Semiconductor Fab Equipment

MOQ: 1 set

Air Consumption	50L/min
Air Pressure	5-7kg/cm²
Control System	PLC Control System
Dimensions	1200mm X 800mm X 1500mm
Forming Accuracy	±0.1mm

Polished Trim And Form Dies Semiconductor Package Dies Customizable

MOQ: 1 set

Application	Metal Forming
Compatibility	Compatible With Various Machines
Cost	Affordable
Customization	Available
Durability	High

VIDEO

Single Injection Semiconductor Molding Machine Fully Automatic Transfer Molding

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC
Injection Speed	200 Mm/s

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

tjin@taijinbdt.com

+86 13450030904

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor packaging equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Auto Molding System In Semiconductor Fabrication Equipment 1000 Tons Capacity

Fully Automatic Semiconductor Molding Equipment

90KW Semiconductor Molding Equipment Semicon Transfer Molding Device

1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision

Automatic Layup IC Chip Making Machine Semiconductor Processing Equipment ISO9001

Auto Plastic Cutting And Molding Semiconductor Manufacturing Equipment

Plastic Cutting Molding Semiconductor Production Equipment 220V/50Hz

Industrail 2.5kW Trim And Form Machine Semiconductor Fab Equipment

Polished Trim And Form Dies Semiconductor Package Dies Customizable

Single Injection Semiconductor Molding Machine Fully Automatic Transfer Molding